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CLASS

Code:
0112/2///61360_4#AAA057

Version:
002

Revision:
02

IRDI:
0112/2///61360_4#AAA057#002

Preferred name:
integrated circuit

Synonymous name:
IC

Coded name:

Short name:
IC

Definition:
circuit in which all or some of the circuit elements are inseparably associated and electrically interconnected such that are considered to be indivisible for the purpose of construction and commerce

Note:

Remark:

Definition source:
IEC 60748-1 Amend. 2(IV.2.3) (1993)

Drawing:

Class type:
ITEM_CLASS

Applicable documents:

Class value assignment:

Requisity of properties:

Superclass:
0112/2///61360_4#AAA002

Higher level classes:

Classifying DET:
0112/2///61360_4#AAE077 - signal type


0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
0112/2///61360_4#AAD183 - simulator compliance
0112/2///61360_4#AAD184 - simulator applicability
0112/2///61360_4#AAD185 - wafer thickness
0112/2///61360_4#AAD186 - wafer thickness tolerance
0112/2///61360_4#AAD187 - wafer map
0112/2///61360_4#AAD188 - bump shape
0112/2///61360_4#AAD189 - bump drawing
0112/2///61360_4#AAD190 - bump attachment method
0112/2///61360_4#AAD196 - moisture sensitivity level
0112/2///61360_4#AAD199 - outline drawing
0112/2///61360_4#AAE074 - IC application field
0112/2///61360_4#AAE077 - signal type
0112/2///61360_4#AAE086 - supply voltage limit
0112/2///61360_4#AAE106 - number of functions
0112/2///61360_4#AAE210 - input voltage limit
0112/2///61360_4#AAE214 - power dissipation per output
0112/2///61360_4#AAE336 - mounting base temperature
0112/2///61360_4#AAE337 - junction temperature
0112/2///61360_4#AAE442 - colour TV transmission
0112/2///61360_4#AAE458 - number of inputs
0112/2///61360_4#AAE487 - frequency band
0112/2///61360_4#AAE490 - modulation method
0112/2///61360_4#AAE686 - IC technology
0112/2///61360_4#AAE690 - supply voltage
0112/2///61360_4#AAE691 - supply current
0112/2///61360_4#AAE786 - mode of operation
0112/2///61360_4#AAE838 - IC package code
0112/2///61360_4#AAE898 - input capacitance
0112/2///61360_4#AAF275 - junction stress temperature
0112/2///61360_4#AAE014 - ambient temperature

Properties tree:

Open all | Close all


Inherited properties:

SuperBlocks:

Is case of:

Imported properties:

Instance sharable:

Status level:
Standard

Is deprecated:

Published in:
IEC 61360-4

Published by:
IEC

Proposal date:
2023-04-17

Version initiation date:
2010-11-11

Version release date:
2015-03-13

Revision release date:
2023-04-17

Obsolete date:

Responsible Committee:
IEC/SC 3D

Change request ID:
C00115


002-02 (2023-04-17 09:58:32 by BATCH 00001245) standard


CLASSE

Code:
0112/2///61360_4#AAA057

Version:
002

Révision:
02

IRDI:
0112/2///61360_4#AAA057#002

Nom préféré:

Nom synonyme:

Nom codé:

Nom court:

Définition:

Note:

Remarque:

Traducteur:

Version de traduction:

Date de traduction:

Source de définition:
IEC 60748-1 Amend. 2(IV.2.3) (1993)

Dessin:

Class type:
ITEM_CLASS

Applicable documents:

Class value assignment:

Requisity of properties:

Superclasse:
0112/2///61360_4#AAA002

Classes supérieures:

DET de classification:
0112/2///61360_4#AAE077 - signal type


0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
0112/2///61360_4#AAD183 - simulator compliance
0112/2///61360_4#AAD184 - simulator applicability
0112/2///61360_4#AAD185 - wafer thickness
0112/2///61360_4#AAD186 - wafer thickness tolerance
0112/2///61360_4#AAD187 - wafer map
0112/2///61360_4#AAD188 - bump shape
0112/2///61360_4#AAD189 - bump drawing
0112/2///61360_4#AAD190 - bump attachment method
0112/2///61360_4#AAD196 - moisture sensitivity level
0112/2///61360_4#AAD199 - outline drawing
0112/2///61360_4#AAE074 - IC application field
0112/2///61360_4#AAE077 - signal type
0112/2///61360_4#AAE086 - supply voltage limit
0112/2///61360_4#AAE106 - number of functions
0112/2///61360_4#AAE210 - input voltage limit
0112/2///61360_4#AAE214 - power dissipation per output
0112/2///61360_4#AAE336 - mounting base temperature
0112/2///61360_4#AAE337 - junction temperature
0112/2///61360_4#AAE442 - colour TV transmission
0112/2///61360_4#AAE458 - number of inputs
0112/2///61360_4#AAE487 - frequency band
0112/2///61360_4#AAE490 - modulation method
0112/2///61360_4#AAE686 - IC technology
0112/2///61360_4#AAE690 - supply voltage
0112/2///61360_4#AAE691 - supply current
0112/2///61360_4#AAE786 - mode of operation
0112/2///61360_4#AAE838 - IC package code
0112/2///61360_4#AAE898 - input capacitance
0112/2///61360_4#AAF275 - junction stress temperature
0112/2///61360_4#AAE014 - ambient temperature

Propriétés:

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Propriétés héritées:

Is case of:

Imported properties:

Instance sharable:

Statut:
Standard

Is deprecated:

Publié dans:
IEC 61360-4

Publié par:
IEC

Date de proposition:
2023-04-17

Version, date d'initialisation:
2010-11-11

Version, date de publication:
2015-03-13

Revision release date:
2023-04-17

Date d'obsolescence:

Responsible Committee:
IEC/SC 3D

Change request ID:
C00115


002-02 (2023-04-17 09:58:32 by BATCH 00001245) standard


KLASSE

Code:
0112/2///61360_4#AAA057

Version:
002

Revision:
02

IRDI:
0112/2///61360_4#AAA057#002

Bevorzugter Name:

Synonym:

Code:

Kurzbezeichnung:

Definition:

Notiz:

Bemerkung:

Übersetzer:

Übersetzung, Revision:

Übersetzung, Revisionsdatum:

Quelle der Definition:
IEC 60748-1 Amend. 2(IV.2.3) (1993)

Zeichnung:

Class type:
ITEM_CLASS

Applicable documents:

Class value assignment:

Requisity of properties:

Oberbegriff:
0112/2///61360_4#AAA002

Übergeordnete Klassen:

Klassifizierendes Datenelement:
0112/2///61360_4#AAE077 - signal type


0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
0112/2///61360_4#AAD183 - simulator compliance
0112/2///61360_4#AAD184 - simulator applicability
0112/2///61360_4#AAD185 - wafer thickness
0112/2///61360_4#AAD186 - wafer thickness tolerance
0112/2///61360_4#AAD187 - wafer map
0112/2///61360_4#AAD188 - bump shape
0112/2///61360_4#AAD189 - bump drawing
0112/2///61360_4#AAD190 - bump attachment method
0112/2///61360_4#AAD196 - moisture sensitivity level
0112/2///61360_4#AAD199 - outline drawing
0112/2///61360_4#AAE074 - IC application field
0112/2///61360_4#AAE077 - signal type
0112/2///61360_4#AAE086 - supply voltage limit
0112/2///61360_4#AAE106 - number of functions
0112/2///61360_4#AAE210 - input voltage limit
0112/2///61360_4#AAE214 - power dissipation per output
0112/2///61360_4#AAE336 - mounting base temperature
0112/2///61360_4#AAE337 - junction temperature
0112/2///61360_4#AAE442 - colour TV transmission
0112/2///61360_4#AAE458 - number of inputs
0112/2///61360_4#AAE487 - frequency band
0112/2///61360_4#AAE490 - modulation method
0112/2///61360_4#AAE686 - IC technology
0112/2///61360_4#AAE690 - supply voltage
0112/2///61360_4#AAE691 - supply current
0112/2///61360_4#AAE786 - mode of operation
0112/2///61360_4#AAE838 - IC package code
0112/2///61360_4#AAE898 - input capacitance
0112/2///61360_4#AAF275 - junction stress temperature
0112/2///61360_4#AAE014 - Umgebungstemperatur

Merkmale:

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Übernommene Merkmale:

Is case of:

Imported properties:

Instance sharable:

Status:
Standard

Is deprecated:

Veröffentlicht in:
IEC 61360-4

Veröffentlicht von:
IEC

Datum des Vorschlags:
2023-04-17

Version, Veranlassungsdatum:
2010-11-11

Version, Freigabedatum:
2015-03-13

Revision release date:
2023-04-17

Gestrichen seit:

Responsible Committee:
IEC/SC 3D

Change request ID:
C00115


002-02 (2023-04-17 09:58:32 by BATCH 00001245) standard


分類（クラス）

識別コード:
0112/2///61360_4#AAA057

改訂版:
002

修正刷:
02

IRDI:
0112/2///61360_4#AAA057#002

推奨名:

別名:

コード化された名称:

略称:

定義:

注記:

備考:

翻訳者:

翻訳第　m 版:

翻訳版発行日:

定義出典:
IEC 60748-1 Amend. 2(IV.2.3) (1993)

図:

Class type:
ITEM_CLASS

Applicable documents:

Class value assignment:

Requisity of properties:

上位分類:
0112/2///61360_4#AAA002

上位クラス:

分類プロパティ:
0112/2///61360_4#AAE077 - signal type


0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
0112/2///61360_4#AAD183 - simulator compliance
0112/2///61360_4#AAD184 - simulator applicability
0112/2///61360_4#AAD185 - wafer thickness
0112/2///61360_4#AAD186 - wafer thickness tolerance
0112/2///61360_4#AAD187 - wafer map
0112/2///61360_4#AAD188 - bump shape
0112/2///61360_4#AAD189 - bump drawing
0112/2///61360_4#AAD190 - bump attachment method
0112/2///61360_4#AAD196 - moisture sensitivity level
0112/2///61360_4#AAD199 - outline drawing
0112/2///61360_4#AAE074 - IC application field
0112/2///61360_4#AAE077 - signal type
0112/2///61360_4#AAE086 - supply voltage limit
0112/2///61360_4#AAE106 - number of functions
0112/2///61360_4#AAE210 - input voltage limit
0112/2///61360_4#AAE214 - power dissipation per output
0112/2///61360_4#AAE336 - mounting base temperature
0112/2///61360_4#AAE337 - junction temperature
0112/2///61360_4#AAE442 - colour TV transmission
0112/2///61360_4#AAE458 - number of inputs
0112/2///61360_4#AAE487 - frequency band
0112/2///61360_4#AAE490 - modulation method
0112/2///61360_4#AAE686 - IC technology
0112/2///61360_4#AAE690 - supply voltage
0112/2///61360_4#AAE691 - supply current
0112/2///61360_4#AAE786 - mode of operation
0112/2///61360_4#AAE838 - IC package code
0112/2///61360_4#AAE898 - input capacitance
0112/2///61360_4#AAF275 - junction stress temperature
0112/2///61360_4#AAE014 - ambient temperature

プロパティ:

Open all | Close all


継承プロパティ:

Is case of:

Imported properties:

Instance sharable:

状態:
標準

Is deprecated:

公開:
IEC 61360-4

公開者:
IEC

提案日時:
2023-04-17

初版作成日:
2010-11-11

改訂版公開日:
2015-03-13

Revision release date:
2023-04-17

廃用期日:

Responsible Committee:
IEC/SC 3D

Change request ID:
C00115


002-02 (2023-04-17 09:58:32 by BATCH 00001245) standard


类

代码:
0112/2///61360_4#AAA057

版本号:
002

修订号:
02

IRDI:
0112/2///61360_4#AAA057#002

推荐名:

同义名:

代码名:

短名:

定义:

注释:

备注:

Translator (to be translated in Chinese):

Translation revison (to be translated in Chinese):

Translation revision date (to be translated in Chinese):

定义来源:
IEC 60748-1 Amend. 2(IV.2.3) (1993)

图:

类类型:
ITEM_CLASS

适用文档:

Class value assignment:

特性的必要性:

超类:
0112/2///61360_4#AAA002

上层类:

分类DET:
0112/2///61360_4#AAE077 - signal type


0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
0112/2///61360_4#AAD183 - simulator compliance
0112/2///61360_4#AAD184 - simulator applicability
0112/2///61360_4#AAD185 - wafer thickness
0112/2///61360_4#AAD186 - wafer thickness tolerance
0112/2///61360_4#AAD187 - wafer map
0112/2///61360_4#AAD188 - bump shape
0112/2///61360_4#AAD189 - bump drawing
0112/2///61360_4#AAD190 - bump attachment method
0112/2///61360_4#AAD196 - moisture sensitivity level
0112/2///61360_4#AAD199 - outline drawing
0112/2///61360_4#AAE074 - IC application field
0112/2///61360_4#AAE077 - signal type
0112/2///61360_4#AAE086 - supply voltage limit
0112/2///61360_4#AAE106 - number of functions
0112/2///61360_4#AAE210 - input voltage limit
0112/2///61360_4#AAE214 - power dissipation per output
0112/2///61360_4#AAE336 - mounting base temperature
0112/2///61360_4#AAE337 - junction temperature
0112/2///61360_4#AAE442 - colour TV transmission
0112/2///61360_4#AAE458 - number of inputs
0112/2///61360_4#AAE487 - frequency band
0112/2///61360_4#AAE490 - modulation method
0112/2///61360_4#AAE686 - IC technology
0112/2///61360_4#AAE690 - supply voltage
0112/2///61360_4#AAE691 - supply current
0112/2///61360_4#AAE786 - mode of operation
0112/2///61360_4#AAE838 - IC package code
0112/2///61360_4#AAE898 - input capacitance
0112/2///61360_4#AAF275 - junction stress temperature
0112/2///61360_4#AAE014 - ambient temperature

特性树:

Open all | Close all


Inherited properties:

Is case of:

输入特性:

Instance sharable:

状态级别:
Standard (to be translated)

Is deprecated:

发布:
IEC 61360-4

发布者:
IEC

提议日期:
2023-04-17

版本生成日期:
2010-11-11

版本发布日期:
2015-03-13

修订发布日期:
2023-04-17

废止日期:

负责委员会:
IEC/SC 3D

变更请求号:
C00115


002-02 (2023-04-17 09:58:32 by BATCH 00001245) standard

Version history
Historique
Historie
版改訂履歴:
版本历史:
002-02 (2023-04-17 09:58:32 by BATCH 00001245) standard


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