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CLASS
Code:
0112/2///61360_4#AAA057
Version:
002
(Superseded version or revision)
Revision:
01
IRDI:
0112/2///61360_4#AAA057#002
Preferred name:
integrated circuit
Synonymous name:
IC
Coded name:
Short name:
IC
Definition:
circuit in which all or some of the circuit elements are inseparably associated and electrically interconnected such that are considered to be indivisible for the purpose of construction and commerce
Note:
Remark:
Definition source:
[IEC 60748-1 Amend. 2(IV.2.3) (1993)]
Drawing:
Class type:
ITEM_CLASS
Applicable documents:
Class value assignment:
Requisity of properties:
Superclass:
0112/2///61360_4#AAA002
Higher level classes:
Classifying DET:
0112/2///61360_4#AAE077 - signal type
Properties:
Properties:
0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
.....
0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
0112/2///61360_4#AAD183 - simulator compliance
0112/2///61360_4#AAD184 - simulator applicability
0112/2///61360_4#AAD185 - wafer thickness
0112/2///61360_4#AAD186 - wafer thickness tolerance
0112/2///61360_4#AAD187 - wafer map
0112/2///61360_4#AAD188 - bump shape
0112/2///61360_4#AAD189 - bump drawing
0112/2///61360_4#AAD190 - bump attachment method
0112/2///61360_4#AAD196 - moisture sensitivity level
0112/2///61360_4#AAD199 - outline drawing
0112/2///61360_4#AAE074 - IC application field
0112/2///61360_4#AAE077 - signal type
0112/2///61360_4#AAE086 - supply voltage limit
0112/2///61360_4#AAE106 - number of functions
0112/2///61360_4#AAE210 - input voltage limit
0112/2///61360_4#AAE214 - power dissipation per output
0112/2///61360_4#AAE336 - mounting base temperature
0112/2///61360_4#AAE337 - junction temperature
0112/2///61360_4#AAE442 - colour TV transmission
0112/2///61360_4#AAE458 - number of inputs
0112/2///61360_4#AAE487 - frequency band
0112/2///61360_4#AAE490 - modulation method
0112/2///61360_4#AAE686 - IC technology
0112/2///61360_4#AAE690 - supply voltage
0112/2///61360_4#AAE691 - supply current
0112/2///61360_4#AAE786 - mode of operation
0112/2///61360_4#AAE838 - IC package code
0112/2///61360_4#AAE898 - input capacitance
0112/2///61360_4#AAF275 - junction stress temperature
0112/2///61360_4#AAE014 - ambient temperature
Properties tree:
Open all
|
Close all
Inherited properties:
SuperBlocks:
Is case of:
Imported properties:
Instance sharable:
Status level:
Superseded
Is deprecated:
Published in:
IEC 61360-4
Published by:
IEC
Proposal date:
2015-01-20
Version initiation date:
2010-11-11
Version release date:
2015-03-13
Revision release date:
2015-03-13
Obsolete date:
Responsible Committee:
SC3D
Change request ID:
C00035
Version history:
Version history:
002-02 (2023-04-17 09:58:32 by BATCH 00001245)
standard
CLASSE
Code:
0112/2///61360_4#AAA057
Version:
002
Révision:
01
IRDI:
0112/2///61360_4#AAA057#002
Nom préféré:
Nom synonyme:
Nom codé:
Nom court:
Définition:
Note:
Remarque:
Traducteur:
Version de traduction:
Date de traduction:
Source de définition:
[IEC 60748-1 Amend. 2(IV.2.3) (1993)]
Dessin:
Class type:
ITEM_CLASS
Applicable documents:
Class value assignment:
Requisity of properties:
Superclasse:
0112/2///61360_4#AAA002
Classes supérieures:
DET de classification:
0112/2///61360_4#AAE077 - signal type
Propriétés:
Propriétés:
0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
.....
0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
0112/2///61360_4#AAD183 - simulator compliance
0112/2///61360_4#AAD184 - simulator applicability
0112/2///61360_4#AAD185 - wafer thickness
0112/2///61360_4#AAD186 - wafer thickness tolerance
0112/2///61360_4#AAD187 - wafer map
0112/2///61360_4#AAD188 - bump shape
0112/2///61360_4#AAD189 - bump drawing
0112/2///61360_4#AAD190 - bump attachment method
0112/2///61360_4#AAD196 - moisture sensitivity level
0112/2///61360_4#AAD199 - outline drawing
0112/2///61360_4#AAE074 - IC application field
0112/2///61360_4#AAE077 - signal type
0112/2///61360_4#AAE086 - supply voltage limit
0112/2///61360_4#AAE106 - number of functions
0112/2///61360_4#AAE210 - input voltage limit
0112/2///61360_4#AAE214 - power dissipation per output
0112/2///61360_4#AAE336 - mounting base temperature
0112/2///61360_4#AAE337 - junction temperature
0112/2///61360_4#AAE442 - colour TV transmission
0112/2///61360_4#AAE458 - number of inputs
0112/2///61360_4#AAE487 - frequency band
0112/2///61360_4#AAE490 - modulation method
0112/2///61360_4#AAE686 - IC technology
0112/2///61360_4#AAE690 - supply voltage
0112/2///61360_4#AAE691 - supply current
0112/2///61360_4#AAE786 - mode of operation
0112/2///61360_4#AAE838 - IC package code
0112/2///61360_4#AAE898 - input capacitance
0112/2///61360_4#AAF275 - junction stress temperature
0112/2///61360_4#AAE014 - ambient temperature
Propriétés:
Open all
|
Close all
Propriétés héritées:
Is case of:
Imported properties:
Instance sharable:
Statut:
Remplacé
Is deprecated:
Publié dans:
IEC 61360-4
Publié par:
IEC
Date de proposition:
2015-01-20
Version, date d'initialisation:
2010-11-11
Version, date de publication:
2015-03-13
Revision release date:
2015-03-13
Date d'obsolescence:
Responsible Committee:
SC3D
Change request ID:
C00035
Historique:
Historique:
002-02 (2023-04-17 09:58:32 by BATCH 00001245)
standard
KLASSE
Code:
0112/2///61360_4#AAA057
Version:
002
Revision:
01
IRDI:
0112/2///61360_4#AAA057#002
Bevorzugter Name:
Synonym:
Code:
Kurzbezeichnung:
Definition:
Notiz:
Bemerkung:
Übersetzer:
Übersetzung, Revision:
Übersetzung, Revisionsdatum:
Quelle der Definition:
[IEC 60748-1 Amend. 2(IV.2.3) (1993)]
Zeichnung:
Class type:
ITEM_CLASS
Applicable documents:
Class value assignment:
Requisity of properties:
Oberbegriff:
0112/2///61360_4#AAA002
Übergeordnete Klassen:
Klassifizierendes Datenelement:
0112/2///61360_4#AAE077 - signal type
Merkmale:
Merkmale:
0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
.....
0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
0112/2///61360_4#AAD183 - simulator compliance
0112/2///61360_4#AAD184 - simulator applicability
0112/2///61360_4#AAD185 - wafer thickness
0112/2///61360_4#AAD186 - wafer thickness tolerance
0112/2///61360_4#AAD187 - wafer map
0112/2///61360_4#AAD188 - bump shape
0112/2///61360_4#AAD189 - bump drawing
0112/2///61360_4#AAD190 - bump attachment method
0112/2///61360_4#AAD196 - moisture sensitivity level
0112/2///61360_4#AAD199 - outline drawing
0112/2///61360_4#AAE074 - IC application field
0112/2///61360_4#AAE077 - signal type
0112/2///61360_4#AAE086 - supply voltage limit
0112/2///61360_4#AAE106 - number of functions
0112/2///61360_4#AAE210 - input voltage limit
0112/2///61360_4#AAE214 - power dissipation per output
0112/2///61360_4#AAE336 - mounting base temperature
0112/2///61360_4#AAE337 - junction temperature
0112/2///61360_4#AAE442 - colour TV transmission
0112/2///61360_4#AAE458 - number of inputs
0112/2///61360_4#AAE487 - frequency band
0112/2///61360_4#AAE490 - modulation method
0112/2///61360_4#AAE686 - IC technology
0112/2///61360_4#AAE690 - supply voltage
0112/2///61360_4#AAE691 - supply current
0112/2///61360_4#AAE786 - mode of operation
0112/2///61360_4#AAE838 - IC package code
0112/2///61360_4#AAE898 - input capacitance
0112/2///61360_4#AAF275 - junction stress temperature
0112/2///61360_4#AAE014 - Umgebungstemperatur
Merkmale:
Open all
|
Close all
Übernommene Merkmale:
Is case of:
Imported properties:
Instance sharable:
Status:
Superseded
Is deprecated:
Veröffentlicht in:
IEC 61360-4
Veröffentlicht von:
IEC
Datum des Vorschlags:
2015-01-20
Version, Veranlassungsdatum:
2010-11-11
Version, Freigabedatum:
2015-03-13
Revision release date:
2015-03-13
Gestrichen seit:
Responsible Committee:
SC3D
Change request ID:
C00035
Historie:
Historie:
002-02 (2023-04-17 09:58:32 by BATCH 00001245)
standard
分類(クラス)
識別コード:
0112/2///61360_4#AAA057
改訂版:
002
修正刷:
01
IRDI:
0112/2///61360_4#AAA057#002
推奨名:
別名:
コード化された名称:
略称:
定義:
注記:
備考:
翻訳者:
翻訳第 m 版:
翻訳版発行日:
定義出典:
[IEC 60748-1 Amend. 2(IV.2.3) (1993)]
図:
Class type:
ITEM_CLASS
Applicable documents:
Class value assignment:
Requisity of properties:
上位分類:
0112/2///61360_4#AAA002
上位クラス:
分類プロパティ:
0112/2///61360_4#AAE077 - signal type
プロパティ:
プロパティ:
0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
.....
0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
0112/2///61360_4#AAD183 - simulator compliance
0112/2///61360_4#AAD184 - simulator applicability
0112/2///61360_4#AAD185 - wafer thickness
0112/2///61360_4#AAD186 - wafer thickness tolerance
0112/2///61360_4#AAD187 - wafer map
0112/2///61360_4#AAD188 - bump shape
0112/2///61360_4#AAD189 - bump drawing
0112/2///61360_4#AAD190 - bump attachment method
0112/2///61360_4#AAD196 - moisture sensitivity level
0112/2///61360_4#AAD199 - outline drawing
0112/2///61360_4#AAE074 - IC application field
0112/2///61360_4#AAE077 - signal type
0112/2///61360_4#AAE086 - supply voltage limit
0112/2///61360_4#AAE106 - number of functions
0112/2///61360_4#AAE210 - input voltage limit
0112/2///61360_4#AAE214 - power dissipation per output
0112/2///61360_4#AAE336 - mounting base temperature
0112/2///61360_4#AAE337 - junction temperature
0112/2///61360_4#AAE442 - colour TV transmission
0112/2///61360_4#AAE458 - number of inputs
0112/2///61360_4#AAE487 - frequency band
0112/2///61360_4#AAE490 - modulation method
0112/2///61360_4#AAE686 - IC technology
0112/2///61360_4#AAE690 - supply voltage
0112/2///61360_4#AAE691 - supply current
0112/2///61360_4#AAE786 - mode of operation
0112/2///61360_4#AAE838 - IC package code
0112/2///61360_4#AAE898 - input capacitance
0112/2///61360_4#AAF275 - junction stress temperature
0112/2///61360_4#AAE014 - ambient temperature
プロパティ:
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継承プロパティ:
Is case of:
Imported properties:
Instance sharable:
状態:
取って代わら
Is deprecated:
公開:
IEC 61360-4
公開者:
IEC
提案日時:
2015-01-20
初版作成日:
2010-11-11
改訂版公開日:
2015-03-13
Revision release date:
2015-03-13
廃用期日:
Responsible Committee:
SC3D
Change request ID:
C00035
版改訂履歴:
版改訂履歴:
002-02 (2023-04-17 09:58:32 by BATCH 00001245)
standard
类
代码:
0112/2///61360_4#AAA057
版本号:
002
修订号:
01
IRDI:
0112/2///61360_4#AAA057#002
推荐名:
同义名:
代码名:
短名:
定义:
注释:
备注:
Translator (to be translated in Chinese):
Translation revison (to be translated in Chinese):
Translation revision date (to be translated in Chinese):
定义来源:
[IEC 60748-1 Amend. 2(IV.2.3) (1993)]
图:
类类型:
ITEM_CLASS
适用文档:
Class value assignment:
特性的必要性:
超类:
0112/2///61360_4#AAA002
上层类:
分类DET:
0112/2///61360_4#AAE077 - signal type
特性:
特性:
0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
.....
0112/2///61360_4#AAD175 - function
0112/2///61360_4#AAD179 - simulator model file
0112/2///61360_4#AAD180 - simulator model file date
0112/2///61360_4#AAD181 - simulator name
0112/2///61360_4#AAD182 - simulator version
0112/2///61360_4#AAD183 - simulator compliance
0112/2///61360_4#AAD184 - simulator applicability
0112/2///61360_4#AAD185 - wafer thickness
0112/2///61360_4#AAD186 - wafer thickness tolerance
0112/2///61360_4#AAD187 - wafer map
0112/2///61360_4#AAD188 - bump shape
0112/2///61360_4#AAD189 - bump drawing
0112/2///61360_4#AAD190 - bump attachment method
0112/2///61360_4#AAD196 - moisture sensitivity level
0112/2///61360_4#AAD199 - outline drawing
0112/2///61360_4#AAE074 - IC application field
0112/2///61360_4#AAE077 - signal type
0112/2///61360_4#AAE086 - supply voltage limit
0112/2///61360_4#AAE106 - number of functions
0112/2///61360_4#AAE210 - input voltage limit
0112/2///61360_4#AAE214 - power dissipation per output
0112/2///61360_4#AAE336 - mounting base temperature
0112/2///61360_4#AAE337 - junction temperature
0112/2///61360_4#AAE442 - colour TV transmission
0112/2///61360_4#AAE458 - number of inputs
0112/2///61360_4#AAE487 - frequency band
0112/2///61360_4#AAE490 - modulation method
0112/2///61360_4#AAE686 - IC technology
0112/2///61360_4#AAE690 - supply voltage
0112/2///61360_4#AAE691 - supply current
0112/2///61360_4#AAE786 - mode of operation
0112/2///61360_4#AAE838 - IC package code
0112/2///61360_4#AAE898 - input capacitance
0112/2///61360_4#AAF275 - junction stress temperature
0112/2///61360_4#AAE014 - ambient temperature
特性树:
Open all
|
Close all
Inherited properties:
Is case of:
输入特性:
Instance sharable:
状态级别:
Superseded (to be translated)
Is deprecated:
发布:
IEC 61360-4
发布者:
IEC
提议日期:
2015-01-20
版本生成日期:
2010-11-11
版本发布日期:
2015-03-13
修订发布日期:
2015-03-13
废止日期:
负责委员会:
SC3D
变更请求号:
C00035
版本历史:
版本历史:
002-02 (2023-04-17 09:58:32 by BATCH 00001245)
standard
Version history
Historique
Historie
版改訂履歴:
版本历史:
002-02 (2023-04-17 09:58:32 by BATCH 00001245)
standard
.....
002-01 (2015-01-20 15:48:47 by BATCH 00000890)
superseded
002-01 (2014-12-19 13:10:02 by BATCH 00000881)
superseded
001-03 (2014-10-16 16:38:18 by BATCH 00000879)
superseded
001-02 (2012-05-30 15:03:06 by BATCH 00000788)
superseded
Web page created
2024-05-11
Copyright ©
2024
IEC
, Geneva, Switzerland. All rights reserved