IEC - Common Data Dictionary (CDD)

	CLASS
Code:	0112/2///61360_4#AAA295
Version:	001
Revision:	04
IRDI:	0112/2///61360_4#AAA295#001
Preferred name:	bare die
Synonymous name:
Coded name:
Short name:	BARE
Definition:	unpackaged discrete semiconductor or integrated circuit in the form of singulated die or sawn or unsawn wafers with pads on one surface suitable for interconnection to the substrate or package
Note:
Remark:
Definition source:
Drawing:
Class type:	ITEM_CLASS
Applicable documents:
Class value assignment:
Requisity of properties:
Superclass:	0112/2///61360_4#AAA302
Higher level classes:	0112/2///61360_4#AAA301 - geometry 0112/2///61360_4#AAA000 - electric/electronic components
Classifying DET:
Properties: Properties:	0112/2///61360_4#AAD005 - substrate material 0112/2///61360_4#AAD006 - connection requirement code 0112/2///61360_4#AAD007 - substrate connection 0112/2///61360_4#AAD012 - termination number 0112/2///61360_4#AAD013 - manufacturer pad identifier ..... 0112/2///61360_4#AAD005 - substrate material 0112/2///61360_4#AAD006 - connection requirement code 0112/2///61360_4#AAD007 - substrate connection 0112/2///61360_4#AAD012 - termination number 0112/2///61360_4#AAD013 - manufacturer pad identifier 0112/2///61360_4#AAD014 - pad geometry name 0112/2///61360_4#AAD015 - pad x position 0112/2///61360_4#AAD016 - pad y position 0112/2///61360_4#AAD017 - pad orientation 0112/2///61360_4#AAD018 - number of bond sites 0112/2///61360_4#AAD024 - pad shape 0112/2///61360_4#AAD025 - pad length 0112/2///61360_4#AAD026 - pad width 0112/2///61360_4#AAD027 - number of polygon vertices 0112/2///61360_4#AAD028 - vertex number 0112/2///61360_4#AAD029 - vertex x coordinate 0112/2///61360_4#AAD030 - vertex y coordinate 0112/2///61360_4#AAD078 - passivation material 0112/2///61360_4#AAD091 - connection requirement 0112/2///61360_4#AAD093 - substrate connection 0112/2///61360_4#AAD116 - pad geometry count 0112/2///61360_4#AAD119 - backside finish 0112/2///61360_4#AAD120 - pad metallisation 0112/2///61360_4#AAD121 - pad diameter 0112/2///61360_4#AAD148 - bulk material 0112/2///61360_4#AAD149 - maximum assembly temperature
Properties tree: Open all \| Close all
Inherited properties: Inherited properties:	0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code ..... 0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code 0112/2///61360_4#AAD009 - die yield 0112/2///61360_4#AAD010 - die description 0112/2///61360_4#AAD011 - wafer size 0112/2///61360_4#AAD019 - signal name 0112/2///61360_4#AAD020 - signal type 0112/2///61360_4#AAD021 - electrical reference 0112/2///61360_4#AAD022 - signal direction 0112/2///61360_4#AAD023 - swap codes 0112/2///61360_4#AAD031 - supply variability 0112/2///61360_4#AAD032 - supply voltage 0112/2///61360_4#AAD033 - pad supply current 0112/2///61360_4#AAD049 - supply name 0112/2///61360_4#AAD054 - supply current 0112/2///61360_4#AAD055 - supply packing code 0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD060 - test procedure description 0112/2///61360_4#AAD070 - die step dimension x 0112/2///61360_4#AAD071 - die step dimension y 0112/2///61360_4#AAD072 - die thickness 0112/2///61360_4#AAD082 - test name 0112/2///61360_4#AAD085 - die type 0112/2///61360_4#AAD086 - die type description 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD089 - supply packing 0112/2///61360_4#AAD090 - supply packing description 0112/2///61360_4#AAD095 - die yield code 0112/2///61360_4#AAD117 - size tolerance 0112/2///61360_4#AAD118 - thickness tolerance 0112/2///61360_4#AAD127 - die picture 0112/2///61360_4#AAD129 - die centre x-position 0112/2///61360_4#AAD130 - die centre y-position 0112/2///61360_4#AAD131 - defect rate 0112/2///61360_4#AAD132 - test flow 0112/2///61360_4#AAD133 - temperature specification 0112/2///61360_4#AAD134 - process options 0112/2///61360_4#AAD137 - conformity level 0112/2///61360_4#AAD140 - die manufacturer 0112/2///61360_4#AAD141 - die supplier 0112/2///61360_4#AAD142 - die data source 0112/2///61360_4#AAD143 - packaged part name 0112/2///61360_4#AAD144 - geometric view 0112/2///61360_4#AAD145 - terminal count 0112/2///61360_4#AAD151 - power limit 0112/2///61360_4#AAD153 - test reliability code 0112/2///61360_4#AAD154 - test maturity code 0112/2///61360_4#AAD156 - fiducial name 0112/2///61360_4#AAD157 - fiducial file name 0112/2///61360_4#AAD158 - fiducial width 0112/2///61360_4#AAD159 - fiducial height 0112/2///61360_4#AAD160 - fiducial x position 0112/2///61360_4#AAD161 - fiducial y position 0112/2///61360_4#AAD162 - fiducial orientation 0112/2///61360_4#AAD163 - die step size x 0112/2///61360_4#AAD164 - die step size y 0112/2///61360_4#AAD165 - wafer gross die count 0112/2///61360_4#AAD166 - wafer index type 0112/2///61360_4#AAD167 - wafer index orientation 0112/2///61360_4#AAD168 - reticule step size x 0112/2///61360_4#AAD169 - reticule step size y 0112/2///61360_4#AAD170 - reticule gross die count 0112/2///61360_4#AAD175 - function 0112/2///61360_4#AAD176 - metallisation 0112/2///61360_4#AAD177 - maximum assembly temperature 0112/2///61360_4#AAD178 - maximum temperature time 0112/2///61360_4#AAD179 - simulator model file 0112/2///61360_4#AAD180 - simulator model file date 0112/2///61360_4#AAD181 - simulator name 0112/2///61360_4#AAD182 - simulator version 0112/2///61360_4#AAD183 - simulator compliance 0112/2///61360_4#AAD184 - simulator applicability 0112/2///61360_4#AAD185 - wafer thickness 0112/2///61360_4#AAD186 - wafer thickness tolerance 0112/2///61360_4#AAD187 - wafer map 0112/2///61360_4#AAD188 - bump shape 0112/2///61360_4#AAD189 - bump drawing 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD191 - number of terminals 0112/2///61360_4#AAD192 - terminal position 0112/2///61360_4#AAD193 - terminal shape and size 0112/2///61360_4#AAD194 - device length 0112/2///61360_4#AAD195 - device width 0112/2///61360_4#AAD196 - moisture sensitivity level 0112/2///61360_4#AAD199 - outline drawing 0112/2///61360_4#AAD200 - outgoing quality level 0112/2///61360_4#AAD201 - quality level units 0112/2///61360_4#AAD202 - outgoing quality description 0112/2///61360_4#AAD203 - electrical parameters specified 0112/2///61360_4#AAD204 - standards compliance 0112/2///61360_4#AAD205 - additional screening 0112/2///61360_4#AAD206 - product status 0112/2///61360_4#AAD207 - testability features 0112/2///61360_4#AAD208 - additional test requirements 0112/2///61360_4#AAD209 - reliability 0112/2///61360_4#AAD210 - reliability units 0112/2///61360_4#AAD211 - reliability conditions 0112/2///61360_4#AAD212 - reliability calculation 0112/2///61360_4#AAD213 - reliability reference 0112/2///61360_4#AAD214 - storage conditions 0112/2///61360_4#AAD215 - long-term storage 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAG000 - geometry type
SuperBlocks:
Is case of:
Imported properties:
Instance sharable:
Status level:	Standard
Is deprecated:
Published in:	IEC 61360-4
Published by:	IEC
Proposal date:	2023-04-17
Version initiation date:	2010-11-11
Version release date:	2010-11-11
Revision release date:	2023-04-17
Obsolete date:
Responsible Committee:	IEC/SC 3D
Change request ID:	C00115
Version history: Version history:	001-04 (2023-04-17 09:58:33 by BATCH 00001245) standard

	CLASSE
Code:	0112/2///61360_4#AAA295
Version:	001
Révision:	04
IRDI:	0112/2///61360_4#AAA295#001
Nom préféré:
Nom synonyme:
Nom codé:
Nom court:
Définition:
Note:
Remarque:
Traducteur:
Version de traduction:
Date de traduction:
Source de définition:
Dessin:
Class type:	ITEM_CLASS
Applicable documents:
Class value assignment:
Requisity of properties:
Superclasse:	0112/2///61360_4#AAA302
Classes supérieures:	0112/2///61360_4#AAA301 - geometry 0112/2///61360_4#AAA000 - electric/electronic components
DET de classification:
Propriétés: Propriétés:	0112/2///61360_4#AAD005 - substrate material 0112/2///61360_4#AAD006 - connection requirement code 0112/2///61360_4#AAD007 - substrate connection 0112/2///61360_4#AAD012 - termination number 0112/2///61360_4#AAD013 - manufacturer pad identifier ..... 0112/2///61360_4#AAD005 - substrate material 0112/2///61360_4#AAD006 - connection requirement code 0112/2///61360_4#AAD007 - substrate connection 0112/2///61360_4#AAD012 - termination number 0112/2///61360_4#AAD013 - manufacturer pad identifier 0112/2///61360_4#AAD014 - pad geometry name 0112/2///61360_4#AAD015 - pad x position 0112/2///61360_4#AAD016 - pad y position 0112/2///61360_4#AAD017 - pad orientation 0112/2///61360_4#AAD018 - number of bond sites 0112/2///61360_4#AAD024 - pad shape 0112/2///61360_4#AAD025 - pad length 0112/2///61360_4#AAD026 - pad width 0112/2///61360_4#AAD027 - number of polygon vertices 0112/2///61360_4#AAD028 - vertex number 0112/2///61360_4#AAD029 - vertex x coordinate 0112/2///61360_4#AAD030 - vertex y coordinate 0112/2///61360_4#AAD078 - passivation material 0112/2///61360_4#AAD091 - connection requirement 0112/2///61360_4#AAD093 - substrate connection 0112/2///61360_4#AAD116 - pad geometry count 0112/2///61360_4#AAD119 - backside finish 0112/2///61360_4#AAD120 - pad metallisation 0112/2///61360_4#AAD121 - pad diameter 0112/2///61360_4#AAD148 - bulk material 0112/2///61360_4#AAD149 - maximum assembly temperature
Propriétés: Open all \| Close all
Propriétés héritées: Propriétés héritées:	0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code ..... 0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code 0112/2///61360_4#AAD009 - die yield 0112/2///61360_4#AAD010 - die description 0112/2///61360_4#AAD011 - wafer size 0112/2///61360_4#AAD019 - signal name 0112/2///61360_4#AAD020 - signal type 0112/2///61360_4#AAD021 - electrical reference 0112/2///61360_4#AAD022 - signal direction 0112/2///61360_4#AAD023 - swap codes 0112/2///61360_4#AAD031 - supply variability 0112/2///61360_4#AAD032 - supply voltage 0112/2///61360_4#AAD033 - pad supply current 0112/2///61360_4#AAD049 - supply name 0112/2///61360_4#AAD054 - supply current 0112/2///61360_4#AAD055 - supply packing code 0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD060 - test procedure description 0112/2///61360_4#AAD070 - die step dimension x 0112/2///61360_4#AAD071 - die step dimension y 0112/2///61360_4#AAD072 - die thickness 0112/2///61360_4#AAD082 - test name 0112/2///61360_4#AAD085 - die type 0112/2///61360_4#AAD086 - die type description 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD089 - supply packing 0112/2///61360_4#AAD090 - supply packing description 0112/2///61360_4#AAD095 - die yield code 0112/2///61360_4#AAD117 - size tolerance 0112/2///61360_4#AAD118 - thickness tolerance 0112/2///61360_4#AAD127 - die picture 0112/2///61360_4#AAD129 - die centre x-position 0112/2///61360_4#AAD130 - die centre y-position 0112/2///61360_4#AAD131 - defect rate 0112/2///61360_4#AAD132 - test flow 0112/2///61360_4#AAD133 - temperature specification 0112/2///61360_4#AAD134 - process options 0112/2///61360_4#AAD137 - conformity level 0112/2///61360_4#AAD140 - die manufacturer 0112/2///61360_4#AAD141 - die supplier 0112/2///61360_4#AAD142 - die data source 0112/2///61360_4#AAD143 - packaged part name 0112/2///61360_4#AAD144 - geometric view 0112/2///61360_4#AAD145 - terminal count 0112/2///61360_4#AAD151 - power limit 0112/2///61360_4#AAD153 - test reliability code 0112/2///61360_4#AAD154 - test maturity code 0112/2///61360_4#AAD156 - fiducial name 0112/2///61360_4#AAD157 - fiducial file name 0112/2///61360_4#AAD158 - fiducial width 0112/2///61360_4#AAD159 - fiducial height 0112/2///61360_4#AAD160 - fiducial x position 0112/2///61360_4#AAD161 - fiducial y position 0112/2///61360_4#AAD162 - fiducial orientation 0112/2///61360_4#AAD163 - die step size x 0112/2///61360_4#AAD164 - die step size y 0112/2///61360_4#AAD165 - wafer gross die count 0112/2///61360_4#AAD166 - wafer index type 0112/2///61360_4#AAD167 - wafer index orientation 0112/2///61360_4#AAD168 - reticule step size x 0112/2///61360_4#AAD169 - reticule step size y 0112/2///61360_4#AAD170 - reticule gross die count 0112/2///61360_4#AAD175 - function 0112/2///61360_4#AAD176 - metallisation 0112/2///61360_4#AAD177 - maximum assembly temperature 0112/2///61360_4#AAD178 - maximum temperature time 0112/2///61360_4#AAD179 - simulator model file 0112/2///61360_4#AAD180 - simulator model file date 0112/2///61360_4#AAD181 - simulator name 0112/2///61360_4#AAD182 - simulator version 0112/2///61360_4#AAD183 - simulator compliance 0112/2///61360_4#AAD184 - simulator applicability 0112/2///61360_4#AAD185 - wafer thickness 0112/2///61360_4#AAD186 - wafer thickness tolerance 0112/2///61360_4#AAD187 - wafer map 0112/2///61360_4#AAD188 - bump shape 0112/2///61360_4#AAD189 - bump drawing 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD191 - number of terminals 0112/2///61360_4#AAD192 - terminal position 0112/2///61360_4#AAD193 - terminal shape and size 0112/2///61360_4#AAD194 - device length 0112/2///61360_4#AAD195 - device width 0112/2///61360_4#AAD196 - moisture sensitivity level 0112/2///61360_4#AAD199 - outline drawing 0112/2///61360_4#AAD200 - outgoing quality level 0112/2///61360_4#AAD201 - quality level units 0112/2///61360_4#AAD202 - outgoing quality description 0112/2///61360_4#AAD203 - electrical parameters specified 0112/2///61360_4#AAD204 - standards compliance 0112/2///61360_4#AAD205 - additional screening 0112/2///61360_4#AAD206 - product status 0112/2///61360_4#AAD207 - testability features 0112/2///61360_4#AAD208 - additional test requirements 0112/2///61360_4#AAD209 - reliability 0112/2///61360_4#AAD210 - reliability units 0112/2///61360_4#AAD211 - reliability conditions 0112/2///61360_4#AAD212 - reliability calculation 0112/2///61360_4#AAD213 - reliability reference 0112/2///61360_4#AAD214 - storage conditions 0112/2///61360_4#AAD215 - long-term storage 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAG000 - geometry type
Is case of:
Imported properties:
Instance sharable:
Statut:	Standard
Is deprecated:
Publié dans:	IEC 61360-4
Publié par:	IEC
Date de proposition:	2023-04-17
Version, date d'initialisation:	2010-11-11
Version, date de publication:	2010-11-11
Revision release date:	2023-04-17
Date d'obsolescence:
Responsible Committee:	IEC/SC 3D
Change request ID:	C00115
Historique: Historique:	001-04 (2023-04-17 09:58:33 by BATCH 00001245) standard

	KLASSE
Code:	0112/2///61360_4#AAA295
Version:	001
Revision:	04
IRDI:	0112/2///61360_4#AAA295#001
Bevorzugter Name:
Synonym:
Code:
Kurzbezeichnung:
Definition:
Notiz:
Bemerkung:
Übersetzer:
Übersetzung, Revision:
Übersetzung, Revisionsdatum:
Quelle der Definition:
Zeichnung:
Class type:	ITEM_CLASS
Applicable documents:
Class value assignment:
Requisity of properties:
Oberbegriff:	0112/2///61360_4#AAA302
Übergeordnete Klassen:	0112/2///61360_4#AAA301 - geometry 0112/2///61360_4#AAA000 - electric/electronic components
Klassifizierendes Datenelement:
Merkmale: Merkmale:	0112/2///61360_4#AAD005 - substrate material 0112/2///61360_4#AAD006 - connection requirement code 0112/2///61360_4#AAD007 - substrate connection 0112/2///61360_4#AAD012 - termination number 0112/2///61360_4#AAD013 - manufacturer pad identifier ..... 0112/2///61360_4#AAD005 - substrate material 0112/2///61360_4#AAD006 - connection requirement code 0112/2///61360_4#AAD007 - substrate connection 0112/2///61360_4#AAD012 - termination number 0112/2///61360_4#AAD013 - manufacturer pad identifier 0112/2///61360_4#AAD014 - pad geometry name 0112/2///61360_4#AAD015 - pad x position 0112/2///61360_4#AAD016 - pad y position 0112/2///61360_4#AAD017 - pad orientation 0112/2///61360_4#AAD018 - number of bond sites 0112/2///61360_4#AAD024 - pad shape 0112/2///61360_4#AAD025 - pad length 0112/2///61360_4#AAD026 - pad width 0112/2///61360_4#AAD027 - number of polygon vertices 0112/2///61360_4#AAD028 - vertex number 0112/2///61360_4#AAD029 - vertex x coordinate 0112/2///61360_4#AAD030 - vertex y coordinate 0112/2///61360_4#AAD078 - passivation material 0112/2///61360_4#AAD091 - connection requirement 0112/2///61360_4#AAD093 - substrate connection 0112/2///61360_4#AAD116 - pad geometry count 0112/2///61360_4#AAD119 - backside finish 0112/2///61360_4#AAD120 - pad metallisation 0112/2///61360_4#AAD121 - pad diameter 0112/2///61360_4#AAD148 - bulk material 0112/2///61360_4#AAD149 - maximum assembly temperature
Merkmale: Open all \| Close all
Übernommene Merkmale: Übernommene Merkmale:	0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code ..... 0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code 0112/2///61360_4#AAD009 - die yield 0112/2///61360_4#AAD010 - die description 0112/2///61360_4#AAD011 - wafer size 0112/2///61360_4#AAD019 - signal name 0112/2///61360_4#AAD020 - signal type 0112/2///61360_4#AAD021 - electrical reference 0112/2///61360_4#AAD022 - signal direction 0112/2///61360_4#AAD023 - swap codes 0112/2///61360_4#AAD031 - supply variability 0112/2///61360_4#AAD032 - supply voltage 0112/2///61360_4#AAD033 - pad supply current 0112/2///61360_4#AAD049 - supply name 0112/2///61360_4#AAD054 - supply current 0112/2///61360_4#AAD055 - supply packing code 0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD060 - test procedure description 0112/2///61360_4#AAD070 - die step dimension x 0112/2///61360_4#AAD071 - die step dimension y 0112/2///61360_4#AAD072 - die thickness 0112/2///61360_4#AAD082 - test name 0112/2///61360_4#AAD085 - die type 0112/2///61360_4#AAD086 - die type description 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD089 - supply packing 0112/2///61360_4#AAD090 - supply packing description 0112/2///61360_4#AAD095 - die yield code 0112/2///61360_4#AAD117 - size tolerance 0112/2///61360_4#AAD118 - thickness tolerance 0112/2///61360_4#AAD127 - die picture 0112/2///61360_4#AAD129 - die centre x-position 0112/2///61360_4#AAD130 - die centre y-position 0112/2///61360_4#AAD131 - defect rate 0112/2///61360_4#AAD132 - test flow 0112/2///61360_4#AAD133 - temperature specification 0112/2///61360_4#AAD134 - process options 0112/2///61360_4#AAD137 - conformity level 0112/2///61360_4#AAD140 - die manufacturer 0112/2///61360_4#AAD141 - die supplier 0112/2///61360_4#AAD142 - die data source 0112/2///61360_4#AAD143 - packaged part name 0112/2///61360_4#AAD144 - geometric view 0112/2///61360_4#AAD145 - terminal count 0112/2///61360_4#AAD151 - power limit 0112/2///61360_4#AAD153 - test reliability code 0112/2///61360_4#AAD154 - test maturity code 0112/2///61360_4#AAD156 - fiducial name 0112/2///61360_4#AAD157 - fiducial file name 0112/2///61360_4#AAD158 - fiducial width 0112/2///61360_4#AAD159 - fiducial height 0112/2///61360_4#AAD160 - fiducial x position 0112/2///61360_4#AAD161 - fiducial y position 0112/2///61360_4#AAD162 - fiducial orientation 0112/2///61360_4#AAD163 - die step size x 0112/2///61360_4#AAD164 - die step size y 0112/2///61360_4#AAD165 - wafer gross die count 0112/2///61360_4#AAD166 - wafer index type 0112/2///61360_4#AAD167 - wafer index orientation 0112/2///61360_4#AAD168 - reticule step size x 0112/2///61360_4#AAD169 - reticule step size y 0112/2///61360_4#AAD170 - reticule gross die count 0112/2///61360_4#AAD175 - function 0112/2///61360_4#AAD176 - metallisation 0112/2///61360_4#AAD177 - maximum assembly temperature 0112/2///61360_4#AAD178 - maximum temperature time 0112/2///61360_4#AAD179 - simulator model file 0112/2///61360_4#AAD180 - simulator model file date 0112/2///61360_4#AAD181 - simulator name 0112/2///61360_4#AAD182 - simulator version 0112/2///61360_4#AAD183 - simulator compliance 0112/2///61360_4#AAD184 - simulator applicability 0112/2///61360_4#AAD185 - wafer thickness 0112/2///61360_4#AAD186 - wafer thickness tolerance 0112/2///61360_4#AAD187 - wafer map 0112/2///61360_4#AAD188 - bump shape 0112/2///61360_4#AAD189 - bump drawing 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD191 - number of terminals 0112/2///61360_4#AAD192 - terminal position 0112/2///61360_4#AAD193 - terminal shape and size 0112/2///61360_4#AAD194 - device length 0112/2///61360_4#AAD195 - device width 0112/2///61360_4#AAD196 - moisture sensitivity level 0112/2///61360_4#AAD199 - outline drawing 0112/2///61360_4#AAD200 - outgoing quality level 0112/2///61360_4#AAD201 - quality level units 0112/2///61360_4#AAD202 - outgoing quality description 0112/2///61360_4#AAD203 - electrical parameters specified 0112/2///61360_4#AAD204 - standards compliance 0112/2///61360_4#AAD205 - additional screening 0112/2///61360_4#AAD206 - product status 0112/2///61360_4#AAD207 - testability features 0112/2///61360_4#AAD208 - additional test requirements 0112/2///61360_4#AAD209 - reliability 0112/2///61360_4#AAD210 - reliability units 0112/2///61360_4#AAD211 - reliability conditions 0112/2///61360_4#AAD212 - reliability calculation 0112/2///61360_4#AAD213 - reliability reference 0112/2///61360_4#AAD214 - storage conditions 0112/2///61360_4#AAD215 - long-term storage 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAG000 - geometry type
Is case of:
Imported properties:
Instance sharable:
Status:	Standard
Is deprecated:
Veröffentlicht in:	IEC 61360-4
Veröffentlicht von:	IEC
Datum des Vorschlags:	2023-04-17
Version, Veranlassungsdatum:	2010-11-11
Version, Freigabedatum:	2010-11-11
Revision release date:	2023-04-17
Gestrichen seit:
Responsible Committee:	IEC/SC 3D
Change request ID:	C00115
Historie: Historie:	001-04 (2023-04-17 09:58:33 by BATCH 00001245) standard

	分類（クラス）
識別コード:	0112/2///61360_4#AAA295
改訂版:	001
修正刷:	04
IRDI:	0112/2///61360_4#AAA295#001
推奨名:
別名:
コード化された名称:
略称:
定義:
注記:
備考:
翻訳者:
翻訳第　m 版:
翻訳版発行日:
定義出典:
図:
Class type:	ITEM_CLASS
Applicable documents:
Class value assignment:
Requisity of properties:
上位分類:	0112/2///61360_4#AAA302
上位クラス:	0112/2///61360_4#AAA301 - geometry 0112/2///61360_4#AAA000 - electric/electronic components
分類プロパティ:
プロパティ: プロパティ:	0112/2///61360_4#AAD005 - substrate material 0112/2///61360_4#AAD006 - connection requirement code 0112/2///61360_4#AAD007 - substrate connection 0112/2///61360_4#AAD012 - termination number 0112/2///61360_4#AAD013 - manufacturer pad identifier ..... 0112/2///61360_4#AAD005 - substrate material 0112/2///61360_4#AAD006 - connection requirement code 0112/2///61360_4#AAD007 - substrate connection 0112/2///61360_4#AAD012 - termination number 0112/2///61360_4#AAD013 - manufacturer pad identifier 0112/2///61360_4#AAD014 - pad geometry name 0112/2///61360_4#AAD015 - pad x position 0112/2///61360_4#AAD016 - pad y position 0112/2///61360_4#AAD017 - pad orientation 0112/2///61360_4#AAD018 - number of bond sites 0112/2///61360_4#AAD024 - pad shape 0112/2///61360_4#AAD025 - pad length 0112/2///61360_4#AAD026 - pad width 0112/2///61360_4#AAD027 - number of polygon vertices 0112/2///61360_4#AAD028 - vertex number 0112/2///61360_4#AAD029 - vertex x coordinate 0112/2///61360_4#AAD030 - vertex y coordinate 0112/2///61360_4#AAD078 - passivation material 0112/2///61360_4#AAD091 - connection requirement 0112/2///61360_4#AAD093 - substrate connection 0112/2///61360_4#AAD116 - pad geometry count 0112/2///61360_4#AAD119 - backside finish 0112/2///61360_4#AAD120 - pad metallisation 0112/2///61360_4#AAD121 - pad diameter 0112/2///61360_4#AAD148 - bulk material 0112/2///61360_4#AAD149 - maximum assembly temperature
プロパティ: Open all \| Close all
継承プロパティ: 継承プロパティ:	0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code ..... 0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code 0112/2///61360_4#AAD009 - die yield 0112/2///61360_4#AAD010 - die description 0112/2///61360_4#AAD011 - wafer size 0112/2///61360_4#AAD019 - signal name 0112/2///61360_4#AAD020 - signal type 0112/2///61360_4#AAD021 - electrical reference 0112/2///61360_4#AAD022 - signal direction 0112/2///61360_4#AAD023 - swap codes 0112/2///61360_4#AAD031 - supply variability 0112/2///61360_4#AAD032 - supply voltage 0112/2///61360_4#AAD033 - pad supply current 0112/2///61360_4#AAD049 - supply name 0112/2///61360_4#AAD054 - supply current 0112/2///61360_4#AAD055 - supply packing code 0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD060 - test procedure description 0112/2///61360_4#AAD070 - die step dimension x 0112/2///61360_4#AAD071 - die step dimension y 0112/2///61360_4#AAD072 - die thickness 0112/2///61360_4#AAD082 - test name 0112/2///61360_4#AAD085 - die type 0112/2///61360_4#AAD086 - die type description 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD089 - supply packing 0112/2///61360_4#AAD090 - supply packing description 0112/2///61360_4#AAD095 - die yield code 0112/2///61360_4#AAD117 - size tolerance 0112/2///61360_4#AAD118 - thickness tolerance 0112/2///61360_4#AAD127 - die picture 0112/2///61360_4#AAD129 - die centre x-position 0112/2///61360_4#AAD130 - die centre y-position 0112/2///61360_4#AAD131 - defect rate 0112/2///61360_4#AAD132 - test flow 0112/2///61360_4#AAD133 - temperature specification 0112/2///61360_4#AAD134 - process options 0112/2///61360_4#AAD137 - conformity level 0112/2///61360_4#AAD140 - die manufacturer 0112/2///61360_4#AAD141 - die supplier 0112/2///61360_4#AAD142 - die data source 0112/2///61360_4#AAD143 - packaged part name 0112/2///61360_4#AAD144 - geometric view 0112/2///61360_4#AAD145 - terminal count 0112/2///61360_4#AAD151 - power limit 0112/2///61360_4#AAD153 - test reliability code 0112/2///61360_4#AAD154 - test maturity code 0112/2///61360_4#AAD156 - fiducial name 0112/2///61360_4#AAD157 - fiducial file name 0112/2///61360_4#AAD158 - fiducial width 0112/2///61360_4#AAD159 - fiducial height 0112/2///61360_4#AAD160 - fiducial x position 0112/2///61360_4#AAD161 - fiducial y position 0112/2///61360_4#AAD162 - fiducial orientation 0112/2///61360_4#AAD163 - die step size x 0112/2///61360_4#AAD164 - die step size y 0112/2///61360_4#AAD165 - wafer gross die count 0112/2///61360_4#AAD166 - wafer index type 0112/2///61360_4#AAD167 - wafer index orientation 0112/2///61360_4#AAD168 - reticule step size x 0112/2///61360_4#AAD169 - reticule step size y 0112/2///61360_4#AAD170 - reticule gross die count 0112/2///61360_4#AAD175 - function 0112/2///61360_4#AAD176 - metallisation 0112/2///61360_4#AAD177 - maximum assembly temperature 0112/2///61360_4#AAD178 - maximum temperature time 0112/2///61360_4#AAD179 - simulator model file 0112/2///61360_4#AAD180 - simulator model file date 0112/2///61360_4#AAD181 - simulator name 0112/2///61360_4#AAD182 - simulator version 0112/2///61360_4#AAD183 - simulator compliance 0112/2///61360_4#AAD184 - simulator applicability 0112/2///61360_4#AAD185 - wafer thickness 0112/2///61360_4#AAD186 - wafer thickness tolerance 0112/2///61360_4#AAD187 - wafer map 0112/2///61360_4#AAD188 - bump shape 0112/2///61360_4#AAD189 - bump drawing 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD191 - number of terminals 0112/2///61360_4#AAD192 - terminal position 0112/2///61360_4#AAD193 - terminal shape and size 0112/2///61360_4#AAD194 - device length 0112/2///61360_4#AAD195 - device width 0112/2///61360_4#AAD196 - moisture sensitivity level 0112/2///61360_4#AAD199 - outline drawing 0112/2///61360_4#AAD200 - outgoing quality level 0112/2///61360_4#AAD201 - quality level units 0112/2///61360_4#AAD202 - outgoing quality description 0112/2///61360_4#AAD203 - electrical parameters specified 0112/2///61360_4#AAD204 - standards compliance 0112/2///61360_4#AAD205 - additional screening 0112/2///61360_4#AAD206 - product status 0112/2///61360_4#AAD207 - testability features 0112/2///61360_4#AAD208 - additional test requirements 0112/2///61360_4#AAD209 - reliability 0112/2///61360_4#AAD210 - reliability units 0112/2///61360_4#AAD211 - reliability conditions 0112/2///61360_4#AAD212 - reliability calculation 0112/2///61360_4#AAD213 - reliability reference 0112/2///61360_4#AAD214 - storage conditions 0112/2///61360_4#AAD215 - long-term storage 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAG000 - geometry type
Is case of:
Imported properties:
Instance sharable:
状態:	標準
Is deprecated:
公開:	IEC 61360-4
公開者:	IEC
提案日時:	2023-04-17
初版作成日:	2010-11-11
改訂版公開日:	2010-11-11
Revision release date:	2023-04-17
廃用期日:
Responsible Committee:	IEC/SC 3D
Change request ID:	C00115
版改訂履歴: 版改訂履歴:	001-04 (2023-04-17 09:58:33 by BATCH 00001245) standard

	类
代码:	0112/2///61360_4#AAA295
版本号:	001
修订号:	04
IRDI:	0112/2///61360_4#AAA295#001
推荐名:
同义名:
代码名:
短名:
定义:
注释:
备注:
Translator (to be translated in Chinese):
Translation revison (to be translated in Chinese):
Translation revision date (to be translated in Chinese):
定义来源:
图:
类类型:	ITEM_CLASS
适用文档:
Class value assignment:
特性的必要性:
超类:	0112/2///61360_4#AAA302
上层类:	0112/2///61360_4#AAA301 - geometry 0112/2///61360_4#AAA000 - electric/electronic components
分类DET:
特性: 特性:	0112/2///61360_4#AAD005 - substrate material 0112/2///61360_4#AAD006 - connection requirement code 0112/2///61360_4#AAD007 - substrate connection 0112/2///61360_4#AAD012 - termination number 0112/2///61360_4#AAD013 - manufacturer pad identifier ..... 0112/2///61360_4#AAD005 - substrate material 0112/2///61360_4#AAD006 - connection requirement code 0112/2///61360_4#AAD007 - substrate connection 0112/2///61360_4#AAD012 - termination number 0112/2///61360_4#AAD013 - manufacturer pad identifier 0112/2///61360_4#AAD014 - pad geometry name 0112/2///61360_4#AAD015 - pad x position 0112/2///61360_4#AAD016 - pad y position 0112/2///61360_4#AAD017 - pad orientation 0112/2///61360_4#AAD018 - number of bond sites 0112/2///61360_4#AAD024 - pad shape 0112/2///61360_4#AAD025 - pad length 0112/2///61360_4#AAD026 - pad width 0112/2///61360_4#AAD027 - number of polygon vertices 0112/2///61360_4#AAD028 - vertex number 0112/2///61360_4#AAD029 - vertex x coordinate 0112/2///61360_4#AAD030 - vertex y coordinate 0112/2///61360_4#AAD078 - passivation material 0112/2///61360_4#AAD091 - connection requirement 0112/2///61360_4#AAD093 - substrate connection 0112/2///61360_4#AAD116 - pad geometry count 0112/2///61360_4#AAD119 - backside finish 0112/2///61360_4#AAD120 - pad metallisation 0112/2///61360_4#AAD121 - pad diameter 0112/2///61360_4#AAD148 - bulk material 0112/2///61360_4#AAD149 - maximum assembly temperature
特性树: Open all \| Close all
Inherited properties: Inherited properties:	0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code ..... 0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code 0112/2///61360_4#AAD009 - die yield 0112/2///61360_4#AAD010 - die description 0112/2///61360_4#AAD011 - wafer size 0112/2///61360_4#AAD019 - signal name 0112/2///61360_4#AAD020 - signal type 0112/2///61360_4#AAD021 - electrical reference 0112/2///61360_4#AAD022 - signal direction 0112/2///61360_4#AAD023 - swap codes 0112/2///61360_4#AAD031 - supply variability 0112/2///61360_4#AAD032 - supply voltage 0112/2///61360_4#AAD033 - pad supply current 0112/2///61360_4#AAD049 - supply name 0112/2///61360_4#AAD054 - supply current 0112/2///61360_4#AAD055 - supply packing code 0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD060 - test procedure description 0112/2///61360_4#AAD070 - die step dimension x 0112/2///61360_4#AAD071 - die step dimension y 0112/2///61360_4#AAD072 - die thickness 0112/2///61360_4#AAD082 - test name 0112/2///61360_4#AAD085 - die type 0112/2///61360_4#AAD086 - die type description 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD089 - supply packing 0112/2///61360_4#AAD090 - supply packing description 0112/2///61360_4#AAD095 - die yield code 0112/2///61360_4#AAD117 - size tolerance 0112/2///61360_4#AAD118 - thickness tolerance 0112/2///61360_4#AAD127 - die picture 0112/2///61360_4#AAD129 - die centre x-position 0112/2///61360_4#AAD130 - die centre y-position 0112/2///61360_4#AAD131 - defect rate 0112/2///61360_4#AAD132 - test flow 0112/2///61360_4#AAD133 - temperature specification 0112/2///61360_4#AAD134 - process options 0112/2///61360_4#AAD137 - conformity level 0112/2///61360_4#AAD140 - die manufacturer 0112/2///61360_4#AAD141 - die supplier 0112/2///61360_4#AAD142 - die data source 0112/2///61360_4#AAD143 - packaged part name 0112/2///61360_4#AAD144 - geometric view 0112/2///61360_4#AAD145 - terminal count 0112/2///61360_4#AAD151 - power limit 0112/2///61360_4#AAD153 - test reliability code 0112/2///61360_4#AAD154 - test maturity code 0112/2///61360_4#AAD156 - fiducial name 0112/2///61360_4#AAD157 - fiducial file name 0112/2///61360_4#AAD158 - fiducial width 0112/2///61360_4#AAD159 - fiducial height 0112/2///61360_4#AAD160 - fiducial x position 0112/2///61360_4#AAD161 - fiducial y position 0112/2///61360_4#AAD162 - fiducial orientation 0112/2///61360_4#AAD163 - die step size x 0112/2///61360_4#AAD164 - die step size y 0112/2///61360_4#AAD165 - wafer gross die count 0112/2///61360_4#AAD166 - wafer index type 0112/2///61360_4#AAD167 - wafer index orientation 0112/2///61360_4#AAD168 - reticule step size x 0112/2///61360_4#AAD169 - reticule step size y 0112/2///61360_4#AAD170 - reticule gross die count 0112/2///61360_4#AAD175 - function 0112/2///61360_4#AAD176 - metallisation 0112/2///61360_4#AAD177 - maximum assembly temperature 0112/2///61360_4#AAD178 - maximum temperature time 0112/2///61360_4#AAD179 - simulator model file 0112/2///61360_4#AAD180 - simulator model file date 0112/2///61360_4#AAD181 - simulator name 0112/2///61360_4#AAD182 - simulator version 0112/2///61360_4#AAD183 - simulator compliance 0112/2///61360_4#AAD184 - simulator applicability 0112/2///61360_4#AAD185 - wafer thickness 0112/2///61360_4#AAD186 - wafer thickness tolerance 0112/2///61360_4#AAD187 - wafer map 0112/2///61360_4#AAD188 - bump shape 0112/2///61360_4#AAD189 - bump drawing 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD191 - number of terminals 0112/2///61360_4#AAD192 - terminal position 0112/2///61360_4#AAD193 - terminal shape and size 0112/2///61360_4#AAD194 - device length 0112/2///61360_4#AAD195 - device width 0112/2///61360_4#AAD196 - moisture sensitivity level 0112/2///61360_4#AAD199 - outline drawing 0112/2///61360_4#AAD200 - outgoing quality level 0112/2///61360_4#AAD201 - quality level units 0112/2///61360_4#AAD202 - outgoing quality description 0112/2///61360_4#AAD203 - electrical parameters specified 0112/2///61360_4#AAD204 - standards compliance 0112/2///61360_4#AAD205 - additional screening 0112/2///61360_4#AAD206 - product status 0112/2///61360_4#AAD207 - testability features 0112/2///61360_4#AAD208 - additional test requirements 0112/2///61360_4#AAD209 - reliability 0112/2///61360_4#AAD210 - reliability units 0112/2///61360_4#AAD211 - reliability conditions 0112/2///61360_4#AAD212 - reliability calculation 0112/2///61360_4#AAD213 - reliability reference 0112/2///61360_4#AAD214 - storage conditions 0112/2///61360_4#AAD215 - long-term storage 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAG000 - geometry type
Is case of:
输入特性:
Instance sharable:
状态级别:	Standard (to be translated)
Is deprecated:
发布:	IEC 61360-4
发布者:	IEC
提议日期:	2023-04-17
版本生成日期:	2010-11-11
版本发布日期:	2010-11-11
修订发布日期:	2023-04-17
废止日期:
负责委员会:	IEC/SC 3D
变更请求号:	C00115
版本历史: 版本历史:	001-04 (2023-04-17 09:58:33 by BATCH 00001245) standard